# Lead-free Soldering Paste, Sn42 Bi58 Tinning Paste 138 °C Tin Soldering Paste for PCB BGA SMD Electronic Repair (1.05 oz/30 g)

**ASIN:** B0BPLVMJ1T
**Source:** https://www.zonscope.com/amazon/B0BPLVMJ1T

## Highlights

- Composition of soldering clay: Sn: 42%, Bi: 58%.
- Low temperature soldering paste, melting point: 118°C (280F)
- Lead free soldering paste Gross weight: 30g syringe (1.05oz)
- Syringe Soldering Paste Flux Property: Lead free/smooth and even solder joints/flow does not create tin beads and tin br

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